TSMC to conduct pioneering euv lithography research and development
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Taiwan Semiconductor Manufacturing Company is to take delivery of ASML's Twinscan NXE:3100 extreme ultraviolet (euv) lithography system, purportedly making it the first dedicated foundry to conduct on site euv development.
The new system will be installed on TSMC's Fab 12 GigaFab for research and development on future technology generations.
TSMC says it believes euv to be a promising lithography technology for manufacturing ics for future technology nodes and that it has the potential to optimise cost effective manufacturing. EUV technology employs a shorter wavelength and has the potential to reduce costs associated with traditional techniques used to stretch 193nm immersion lithography.
According to senior vice president of research and development at TSMC, euv is just one of the next generation lithography technologies the company is investigating. He said: "Working with this system is in line with our objective of maintaining advanced technology leadership. At the same time, this agreement reinforces our historic commitment to investing in the innovative European semiconductor community which, through ASML and others, will lay a pivotal role in our process technology development in the future."
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