SmartFusion cSoC range expanded for industrial and military applications
1 min read
Microsemi, has announced that its SmartFusion customisable system on chip (cSoC) range is now available in a leaded 208-PQFP package.
According to the semiconductor specialist, the new leaded package reduces overall pcb manufacturing and debugging costs as it requires fewer pcb layers compared to ball grid array and chip scale packages. The device is designed for a range of industrial and military applications such as motor and motion control, gaming machines, solar inverters, military avionics, missiles and weapons.
The PQ208 features an ARM Cortex-M3 based 32bit microcontroller with up to 512KB of flash memory, up to 500K gates of fpga and programmable analogue. Microsemi says its SmartFusion cSoCs are the only devices to integrate these features. The devices are suitable for hardware and embedded designers who need an integrated SoC that provides more flexibility than traditional fixed function microcontrollers. According to Microsemi, it significantly reduces the cost of soft processor cores on traditional fpgas.
"Launching the SmartFusion cSoC in 2010 has expanded our customer base, and a percentage of our new customers expressed the need for the PQ208 package," said Rich Kapusta, vice president terrestrial products, SoC Products Group at Microsemi. "We will continue to listen to our customers and provide a robust range of solutions to suit their exact needs - from leading edge, chip scale packaging to traditional leaded packages."