Spansion targets more applications
Spansion plans to address a broader portion of the high value wireless and embedded markets with its forthcoming MirrorBit ORNAND2 product family. The devices, with initial single chip densities ranging from 1 to 4Gbit at both 1.8 and 3V, use a single level cell architecture.
“The growth of multimedia content on consumer devices is driving rapidly increasing data storage requirements, with very high performance at a low cost,” said Carla Golla, executive vice president, Security and Advanced Technology Division. “Spansion is in a unique position to leverage its MirrorBit technology to create differentiated solutions that bring significant value to its wireless and embedded customers.”
Spansion has extended its agreement with foundry SMIC to produce 43nm ORNAND2 devices on 300mm wafers and expects production to start next year.
