This achievement makes it possible to integrate these two key components into a system-on-chip (SoC) on an advanced RF process for wireless connectivity products, enabling a significantly smaller form factor while providing a level of performance that’s competitive with stand-alone modules.
The smaller area enabled by TSMC’s advanced N6RF+ technology can reduce the size of the wireless connectivity product module by a double-digit percentage.
In addition, the results demonstrated by TSMC and MediaTek show significant improvement in power efficiency for the PMU compared with existing solutions, while iPA performance was competitive with benchmark products. A leading supplier of wireless connectivity solutions, MediaTek is well positioned to leverage these advancements in its next generation of wireless technology.
A direct result of MediaTek and TSMC’s close collaboration on Design-Technology Co-Optimisation (DTCO), MediaTek was able to draw on its product and design expertise to drive system specifications and technology requirements for this project, and TSMC enhanced its technology to enable differentiation in the products.
“After a year of working together on N6RF+, the test chip has exhibited excellent power efficiency gains," said Ching San Wu, Corporate Vice President at MediaTek. "By combining MediaTek's leadership in wireless technology and TSMC's expertise on DTCO, N6RF+ will become a competitive technology for RFSoC projects, creating a significant advantage in the industry."
“Successful DTCO between foundry and customer requires strong mutual trust and teamwork, and we are delighted in this joint accomplishment with a wireless connectivity leader like MediaTek,” added Lipen Yuan, senior director of Advanced Technology Business Development at TSMC. “This achievement on TSMC’s N6RF+ process shows how TSMC combines its leadership in advanced logic and broad portfolio of specialty technologies to provide differentiated solutions for customers’ products.”
