Planned monthly capacity is said to be approximately 3,000 to 3,500 wafers and combined with the contribution from its Kaohsiung fab (Fab 22), monthly capacity for TSMC’s 2nm is projected to exceed 50,000 wafers by the end of 2025 and reach 120,000 to 130,000 wafers per month by the end of 2026.
The industry report further noted that TSMC’s Hsinchu Baoshan 2nm fab will achieve a monthly capacity of 20,000 to 25,000 wafers by the fourth quarter of 2025, scaling up to 60,000 to 65,000 wafers per month by the end of 2026 or early 2027.
The Kaohsiung fab is expected to achieve a monthly capacity of 25,000 to 30,000 wafers by the end of 2025, further expanding to 60,000 to 65,000 wafers per month by the end of 2026 or early 2027.
According to TSMC Chairman C.C. Wei customer demand for 2nm technology is set to surpass that for 3nm, and the company is actively working to expand production capacity.
Industry sources have also revealed that Apple will be TSMC’s first customer for 2nm, with other major players such as MediaTek, Qualcomm, Intel, NVIDIA, AMD, and Broadcom anticipated to follow in adopting this advanced technology.
Additionally, the report mentions that TSMC disclosed at the IEEE International Electron Devices Meeting (IEDM) that N2 technology can reduce power consumption by 24% to 35% or improve performance by 15% at the same voltage. Furthermore, the transistor density of 2nm is 1.15 times higher than that of the previous 3nm generation.
