Those sources have said that both TSMC’s AP8 facility in the Southern Taiwan Science Park and its Chiayi AP7 site have reportedly moved up their equipment installation schedules.
At the Chiayi AP7 site, new equipment installation - originally scheduled for the end of 2025 - has been moved forward to August 2025. The priority at this site is to ramp up production of TSMC’s SoIC (System on Integrated Chip) technology.
At the company’s AP8 facility, which mainly focuses on expanding CoWoS (Chip-on-Wafer-on-Substrate) capacity, new equipment installations are said to be progressing ahead of schedule. Equipment installation is now expected to begin as early as April 2025, with mass production potentially starting in the second half of the year.
TSMC plans to significantly expand its SoIC capacity. The company’s monthly SoIC production was currently around 4,000–5,000 wafers in 2024 but that figure is expected to double to 10,000 wafers in 2025, with the possibility of another doubling in 2026.
Reports suggest that four major companies are currently customers of TSMC’s SoIC technology. AMD was the first to adopt SoIC, while Apple, which is TSMC’s largest customer, is expected to use the SoIC-mH for its upcoming M5 chips, which offers cost advantages over current solutions.
NVIDIA’s next-generation Rubin GPU is also set to adopt TSMC’s SoIC technology, while Broadcom is likewise reported to be among the customers engaged with SoIC.
TSMC’s P1 facility at its Chiayi’s AP7 site is also being developed to support WMCM (Wafer-Level Multi-Chip Module), a hybrid packaging approach that combines InFO and CoWoS technologies. Industry sources believe this technology is likely to be used in future iPhone chip packaging.
TSMC is also advancing silicon photonics and Co-Packaged Optics (CPO) with partners like NVIDIA and Broadcom and reports have suggested that it has integrated CPO with its CoWoS and SoIC platforms and aims to enable 1.6T optical transmission by late 2025, with volume shipments expected in 2026, aligning with NVIDIA’s roadmap.
