Würth addresses challenge of attaching chips to highly integrated substrates
According to Würth Elektronik, attaching chips to highly integrated substrates can be a challenge. Its solution is the encapsulated solder connection process, in which chips are soldered and glued 'face down' in their exact position.
Using thermal compression bonding technology, the flip chip is set onto an anisotropic adhesive containing microscopic soldering particles. By briefly heating the adhesive, the solder particles melt and a true soldering connection is established between the chip's contacts and the substrate. Simultaneous hardening of the epoxy adhesive sets the chip firmly in place. The process is said to be suitable for most substrates.
