KIOXIA unveils high-capacity LC9 series targeting AI applications

KIOXIA Europe has announced the development of its new LC9 Series.

LC9 series targets AI applications Credit: KIOXIA

The 122.88 terabyte (TB) NVMe SSD comes in a 2.5-inch form factor and is the first SSD built with the company’s BiCS FLASH generation 8 3D flash memory technology 2 terabit (Tb) QLC die.

The KIOXIA LC9 Series, remains under development, will be showcased at various upcoming conferences starting later this month.

As AI systems become increasingly sophisticated and data volumes continue to grow, enterprises require improved storage solutions capable of keeping pace with the complex demands of modern workloads.

High-capacity drives are critical for certain phases of the AI process, including large language models (LLMs), training and storing vast datasets, vector databases and the rapid retrieval of information for inference and fine-tuning.

Designed for generative AI applications, this new drive is built for high capacity and provides a PCIe 5.0 interface with dual-port capability for fault tolerance or connectivity to multiple compute systems.

These high-capacity QLC-based SSDs are suitable for deploying with hybrid cloud and multi-cloud systems. High-capacity SSDs feed training and inference data to AI server systems via these cloud configurations.

This KIOXIA SSD complements the recently announced KIOXIA AiSAQ technology, which enhances scalable RAG (Retrieval Augmented Generation) performance by storing vector database elements on SSDs instead of costly, limited DRAM. Additionally, it improves system and rack-level efficiency with higher storage density and lower power consumption per TB compared to lower-capacity SSDs.

KIOXIA LC9 Series SSD highlights include:

  • Dual-port 2.5-inch SSD form factor, 122.88 TB capacity, 0.3 DWPD endurance. (for 5 years)
  • NVMe 2.0, NVMe-MI and PCIe 5.0 specification-compliant (up to 128 gigatransfers per second Gen5 single x4, dual x2 performance capable).
  • Features KIOXIA 2 Tb QLC BiCS FLASHTM generation 8 3D flash memory with CBA (CMOS Bonded to Array) technology, which contributes to making high capacity, high performance and power efficient products.