New package sizes added to Toshiba’s mosfet line up
Looking to help designers make significant pcb savings without compromising performance, Toshiba Electronics Europe has expanded its family of automotive power mosfets to include three new miniature package formats.
The TPCA8xxx, TPCC8xxx and TPCP8xxx families offer N and P channel variants and are provided in SOP Advance, TSON Advance and PS-8 package formats respectively. Dimensions are 5 x 6 x 0.95mm; 3.3 x 3.3 x 0.85mm; and 2.8 x 2.9 x 0.8mm.
All of the new devices are 175°C rated and feature low on resistance and low input capacitance, resulting in low conduction and switching power loss. SOP Advance and TSON Advance packages have bottom side metal heat slugs to conduct heat better than conventional miniature packages, such as SOP-8.
The devices are suited to mid power applications where DPAK devices are conventionally used. TSON advance and PS-8 devices can also replace SOP-8 devices and save board space.
