New Rutronik backplane connector products

The XCede connector platform is designed to provide a 'clear long term migration path for customers who are designing equipment platforms that will need to evolve to enable higher speed signaling and higher levels of performance in future years'. Vertical backplane header configurations provide two, four or six differential signal pairs per column wafer with four, six or eight wafers per signal connector module. The vertical header range also includes options with two wall, three wall, or four wall connector shrouds. Among the three wall options are versions with integrated guide posts and polarisation key openings. The use of advanced engineering polymers in a resonance damping shield is said to eliminate crosstalk resonances and enable very low crosstalk across a wide frequency range. Connectors with six differential pairs per column fit 36mm minimum card slot pitch and provide 82.4 differential signal pairs/inch. Four pair connectors provide 54.9 signal pairs/inch and can be used down to 25mm card slot pitch. Two pair connectors fit on as little as 15mm slot pitch and support 27.5 signal pairs/inch along the card edge. Complementary guidance and power modules are also included in the product range. In addition to providing individual right angle receptacle signal modules, customised groupings of right angle signal, guidance and power modules can be attached to a single wafer organiser to form an integrated daughter card connector.