The new parts are available in Nexperia’s Clip Bond FlatPower (CFP) packages which have a much smaller footprint than SMA/SMB/SMC components.
Trench technology results in low leakage and also greatly reduces the charge, Qrr, stored in the device, as a consequence these rectifiers are able to deliver very fast switching, cutting both the switching losses of the rectifier and the losses that are induced in the MOSFET in the same commutation cell – a configuration that is commonly used in asynchronous switch-mode power converters.
In addition, Nexperia’s PMEGxxxTx devices provide a wide safe operating area (SOA), delivering an extra safety margin and reducing the risk of thermal runaway compared to parts currently available.
Nexperia is now offering 32 devices from 40 V to 100 V and up to 15 A in volume production. A further 17 parts, including the 20 A types, are sampling.
The PMEGxxxTx devices are housed in Clip Bond FlatPower packages CFP3/5/15(B) which have become the industry standard for power diodes. By featuring a solid copper clip, the packages’ thermal resistance is reduced and transfer of heat into the ambient environment is optimised, allowing small and compact PCB designs.
