Said to be the industry's smallest, the TPSM53604 DC/DC buck module’s 5-mm-by-5.5-mm footprint will enable engineers to shrink the size of their power supply by 30% while reducing power loss by 50% when compared to similar competing modules.
The module comes with a single thermal pad to optimize heat transfer, enabling engineers to simplify board mounting and layout.
The TPSM53604 can operate in ambient temperatures as high as 105°C to support rugged applications in factory automation and control, grid infrastructure, test and measurement, industrial transport, and aerospace and defence.
By pairing the TPSM53604 with a compact step-down module such as the TPSM82813 and TPSM82810, engineers can create a complete power solution from a 24-V input down to the point of load, while minimizing design time and effort.
Key benefits and features of the TPSM53604
- Shrink and simplify the power solution: Its total area of 85 mm2 for a single-sided layout is the smallest solution for common 24-V, 4-A industrial applications. The standard QFN footprint helps simplify design and thereby reduce time to market.
- Efficiently dissipate heat at high ambient temperatures: 42% of the TPSM53604’s QFN package footprint touches the board, enabling more efficient heat transfer compared to competing ball-grid-array (BGA) packages. In addition, the module’s buck converter integrates MOSFETs with low drain-source on resistance (RDS(on)) to enable conversion efficiency of 90% at 24 V to 5 V.
- Meet EMI standards: The TPSM53604’s integrated high-frequency bypass capacitors and lack of bond wires help engineers meet the electromagnetic interference (EMI) standard defined by CISPR (Comité International Spécial des Perturbations Radioélectriques) 11 Class B limits.
