Engineering publications brought to you by Mark Allen

How standardising on connectors will enhance military equipment modularity

Complex devices require complex packaging

Will CSR help Qualcomm capture the Internet of Everything?

Best MoS2 transistor performance yet claimed by UCLA team

Photocoupler offers compact replacement for DIP4 packaged devices

Freescale processor has four A53 cores

ARM extends scalability of CoreLink SoC interconnects

Cadence prepares automotive designers for ISO26262

Digi-Key 'encouraged by growth'

MOSFETs suit industrial applications

Innovating the future

Power Management Techniques & Sensor Technologies