Engineering publications brought to you by Mark Allen

Project adapts QTC materials to printed electronics

Wireless alarm and automation system from reichelt

What's in a name?

Bright lights of Williams

Globalfoundries demos first 3D stacked TSV chips on 20nm

Sensing device set to improve DNA sequencing

Solid state device replaces long electrical delay lines in phased array radars

Hybrid memory cube interface spec finalised

iPhone 6 to feature wraparound AMOLED display?

Roadrunner finally meets its match

60V input dc/dc controller said to simplify design

Buck converter offers highest current density