Engineering publications brought to you by Mark Allen

Chiplets

Winbond joins UCIe Consortium to support chiplet interface standardisation

Avery Design Systems announces verification support for new UCIe standard

Industry leaders join forces to standardise chiplet ecosystem

Security IP for Die-to-Die communication between chiplets

Ventana Micro Systems emerged from stealth mode after raising $53mn

CEVA to acquire chip design specialist

Rambus extends high speed interface capabilities

Chiplets to generate $6 billion in semiconductor revenues by 2024

BoW for chiplet-to-chiplet interconnect