Engineering publications brought to you by Mark Allen

Electronics

Applied Materials unveils chip wiring innovations

US-JOINT consortium to develop advanced semiconductor packaging

Kicking the e-waste habit

Europe seeks industry views on China's older generation chips

Global semiconductor sales jump 19.3% in year to May

Free samples of every ST NPI IC now available from Anglia

SiCrystal plans new building for more SiC wafer production

EU project to develop advanced navigation for satellites

Infineon and Swoboda to develop current sensors for electromobility

With AI energy demand surging Google reports jump in emissions

Onsemi acquisition of SWIR Vision Systems expands depth perception and 3D imaging capabilities

New 3D stretchable electronic strip offers opportunities for wearable e-textiles