Engineering publications brought to you by Mark Allen

Electronics

CEA-Leti and Intel to develop atomically thin 2D TMDs on 300mm wafers

Chips all round

Intel goes large with massive new investment in Israel

Quantum-resilient cybersecurity memory module

OKdo selected as Micro:bit Educational Foundation global manufacturer and distributor

OMNIVISION extends global shutter sensors portfolio for In-Cabin applications

Vitesco Technologies and ROHM sign long-term SiC supply partnership

Global 300mm fab equipment spending to reach $119bn in 2026

Graphene used in terahertz-to-visible light conversion for future telecommunications

A £1 billion strategy for the UK’s semiconductor sector

Cadence and Samsung Foundry to expand design IP portfolio

Siemens plans to invest $2.2bn to boost global production