Engineering publications brought to you by Mark Allen

Packaging technology

Ranovus announces second-generation “co-packaged optics” chip

Package pushes performance, cuts manufacturing costs

As space and functionality demands increase, consumer electronics developers are taking a modular approach to designing MEMS

New package for RF power transistors

GaN starts to encroach on LDMOS’ dominance of the power transistor market

Altera uses fine pitch copper bumps in 20nm Arria 10 devices

The importance of selecting the right package for a chip

Power semi packaging breakthrough

Pin out standardisation for 3x3mm mosfets

Packaging progress