Engineering publications brought to you by Mark Allen

Thermal management

Molex unveils versatile VaporConnect optical feedthrough modules

xMEMS introduces active micro-cooling “Fan on a Chip”

Siemens looks to drive 3D-IC adoption with release of Calibre 3DThermal

Microchip launches 10 multi-channel remote temperature sensors

CUI Devices launches thermal design services

Parker offers new gap filler pad with high thermal conductivity

Toshiba announces Thermoflagger over-temperature detection ICs

Simulation framework predicts thermal transport in 5G and 6G RF devices

Research finds faster solve speeds the top priority for thermal engineers

AC-DC power supply thermal management patent enables more efficient design-in

6SigmaET launches latest software version, Release 16

ROHM adds thermal analysis function to its Solution Simulator