Engineering publications brought to you by Mark Allen

Infineon introduces the HybridPACK Drive G2 power module

Germany may restrict export of chip chemicals to China

Top 10 IC design houses see revenues drop almost 10 per cent in Q4 2022

Transphorm introduces new SuperGaN FETs in Standard PQFN packages

Lattice extends low power FPGA portfolio with the MachXO5T-NX family

Microsoft/Activision Blizzard deal blocked

Sony performance-enhanced camera block now commercially available

300W buck-boost non-isolated DC-DC converters have wide range input and outputs

Synopsys, TSMC and Ansys to collaborate on advanced multi-die systems

Q5d unveils robot for automating wiring harness manufacturing

TTTech Auto launches ECU to future-proof automotive E/E architectures

Cadence and TSMC look to accelerate radar, 5G and wireless Innovation