Engineering publications brought to you by Mark Allen

Neil Tyler

ASIC & SoC

Third-generation 112G-LR SerDes IP

Board Level Design

Farnell stocks OrangeCrab FPGA development board

Embedded Systems

ADLINK unveils first PC/104 module with quadro P1000 graphics

ASIC & SoC

GUC announces GLink-3D Die-on-Die interface IP

Consumer

GaN InnoSwitch4-CZ ICs selected for USB-C Nano II chargers

Interconnection

STMicroelectronics looks to deliver protection for high-speed interfaces

EV charging network gets £300m boost

Board Level Design

Cadence unveils low-power IP for PCI Express 5.0 specification on TSMC N5 process

Displays

Building better

Policy & Business

DALI Alliance adopts Thread for DALI+

Embedded Software

IAR Embedded Workbench supports all NXP i.MX RT crossover MCUs

Memory

Avery Design extends collaboration with Rambus