Engineering publications brought to you by Mark Allen

Neil Tyler

Manufacturing

A bold economic vision

Power

Diodes provides smart power delivery solutions for digital ICs

Power

Toshiba releases new LDO for ultra-miniature applications

Consumer

MediaTek’s Dimensity 7300 chips target high-tech smartphones and foldables

Electronics

Arm unveils CSS for Client initiative

ASIC & SoC

World’s first highly integrated multi-mode LTE chipset supporting 450 MHz spectrum

Electronics

CGD signs agreement with ITRI to develop GaN-based power supplies

Electronics

imec unveils die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm

Interconnection

Binder expands M12 portfolio

Power

Infineon announces next generation CoolGaN transistor families

Electronics

Malaysia looks for over $100bn in semiconductor industry investment

Artificial Intelligence

Epic Venture Partners invests $8.1m in Rain AI