Engineering publications brought to you by Mark Allen

Electronics

Toshiba releases new LDO for ultra-miniature applications

High-power Series 144 reed relays from Pickering switch up to 80W while stacking on compact 0.25-inch pitch

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MediaTek’s Dimensity 7300 chips target high-tech smartphones and foldables

Arm unveils CSS for Client initiative

World’s first highly integrated multi-mode LTE chipset supporting 450 MHz spectrum

CGD signs agreement with ITRI to develop GaN-based power supplies

imec unveils die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm

Binder expands M12 portfolio

Infineon announces next generation CoolGaN transistor families

Epic Venture Partners invests $8.1m in Rain AI

xAI raises $6bn as it looks to take on OpenAI