Engineering publications brought to you by Mark Allen

Electronics

Broadcom delivers 200G/lane DSP for Gen AI infrastructure

CEA-Leti paves way to piezoelectric converters without transformers

Renesas develops power-efficient 4th-generation R-Car automotive SoCs

Tata and Analog Devices to explore development of semiconductor ecosystem in India

NXP’s i.MX RT700 crossover MCU targets AI-enabled Edge

A Chinese lesson

Ceva and Edge Impulse partner to accelerate Edge AI application development

OpenLight and Epiphany look to expand PIC ecosystem design capabilities

A Sustainable and Electrified Future

Molex unveils versatile VaporConnect optical feedthrough modules

Ephos raises $8.5m and opens new facility for glass-based quantum photonic chips

Is Qualcomm set to make a move for Intel?