Engineering publications brought to you by Mark Allen

New Electronics

Resilient connectors ready for duty

Report says that promise of AI relies on scaling security as edge AI booms

Nexperia expands power device portfolio with new ideal diodes

Global notebook shipments expected to grow by 3.7% in 2024

Fairview Microwave unveils Wi-Fi 6e/7 omni and flat-panel antennas

dSPACE develops simulation solutions with CIM Database Cloud

More than half of connected devices will be haptic enabled by 2028

Renesas launches ultra compact sensor module for smart air quality monitoring

indie Semiconductor unveils Qi2 MPP-compliant wireless charging solution

Report finds 54% of organisations have experienced data breaches in non-production environments

10Gbps active crossbar mux simplifies smart-cockpit connectivity

xMEMS introduces active micro-cooling “Fan on a Chip”