Engineering publications brought to you by Mark Allen

Semiconductors

World’s first highly integrated multi-mode LTE chipset supporting 450 MHz spectrum

imec unveils die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm

Dolphin Design and Raspberry Pi offer advanced chip power management

HCLTech and Arm collaborate on custom silicon chips for AI workloads

Infineon looks to redefine power density and efficiency in AI server power supplies

Weebit Nano and Efabless collaborate to enable prototyping of SoC designs

Andes Technology and Arteris to accelerate RISC-V SoC adoption

On-chip flow cytometer delivers scalable on-chip detection of human white blood cells

Ambarella unveils Next-Gen AI SoCs for in-vehicle telematics systems

Imec’s NanoIC pilot line to receive investment of €2.5bn

Siemens simplifies development of AI accelerators with Catapult AI NN

RISC-V adoption will be accelerated by AI, according to new research