Engineering publications brought to you by Mark Allen

Memory

Microchip looks to simplify automotive designs

Winbond TrustME W77Q secure Flash obtains SESIP Level 2 certification

Attopsemi I-fuse OTP memories now available on X-FAB’s 180nm technology

Swissbit expands SD memory card portfolio with S-55 and S-58 series

Microchip unveils second SuperFlash offering to be space-qualified

Winbond strengthens DDR3 SDRAM road map

Winbond and Infineon collaborate to double bandwidth for IoT applications with HYPERRAM 3.0

Infineon unveils space-qualified F-RAM for extreme environments

Hynix adopts Spectre FX FastSPICE Simulator to accelerate DRAM design

Weebit Nano ReRAM demo chips now available

KIOXIA to build new fabrication facility at its Kitakami Plant

€3mn grant to develop insect inspired memory devices