Engineering publications brought to you by Mark Allen

New Electronics

Project adapts QTC materials to printed electronics

Wireless alarm and automation system from reichelt

Globalfoundries demos first 3D stacked TSV chips on 20nm

Sensing device set to improve DNA sequencing

Solid state device replaces long electrical delay lines in phased array radars

Hybrid memory cube interface spec finalised

iPhone 6 to feature wraparound AMOLED display?

60V input dc/dc controller said to simplify design

Buck converter offers highest current density

ADI’s ceo Jerry Fishman dies

£1m centre aims to cut cost of leds

First ARM Cortex-A57 processor taped out