Engineering publications brought to you by Mark Allen

New Electronics

Farnell strengthens stock of XP Power solutions products

Frontgrade Gaisler signs contract with ESA to develop RISC-V processor

NEO Semiconductor reveals floating body cell mechanism for 3D X-DRAM

Nordic and Sisvel to streamline cellular IoT SEP licensing

SiPearl unveils key features of the Rhea 1 to accelerate HPC and AI inference

US and China meet to discuss AI risks

Intel in talks to develop Ireland factory

ROLEC offering cutting-edge IP-rated plastic enclosures

Smarter, more efficient technology

Arm planning to launch AI chips in 2025

Amphenol RF unveils antennas supporting Zigbee

PEI-Genesis becomes authorised distributor for Micro-Mode products