Engineering publications brought to you by Mark Allen

News

Automotive

NXP’s S32K3 automotive MCUs ready for AWS cloud services

Artificial Intelligence

Renesas partners with EdgeCortix to streamline AI/ML development

Robotics & UAVs

Bota Systems raises $2.5m in seed round

System Design

CUI Devices launches thermal design services

Electronics

HMD starts manufacturing 5G smartphones in Europe

Space

Microchip’s RT PolarFire FPGA achieves QML Class Q qualification

Space

XCAM secures additional UK Space Agency funding for space camera system

Electronics

Delivering state-of-the-art chip designs

Power

Exeger and Matrix Industries to develop low-power solutions for electronic devices

Artificial Intelligence

Kneron raises $49m in additional funding

Wireless Technology

Pharrowtech and 8devices announce 60GHz wireless module collaboration

EDA & Design Software

Siemens and TSMC collaborate on optimising latest process technologies