AMD releases energy-efficient EPYC Embedded 8004 series

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AMD has announced the release of the EPYC Embedded 8004 Series of processors targeting networking, storage and industrial applications.

Credit: AMD

The AMD EPYC Embedded 8004 Series processor is designed for compute-intensive embedded systems, delivering improved levels of performance for high-demand workloads while maximising power efficiency in a compact form factor for space- and power-constrained applications. It also integrates a comprehensive suite of embedded features to further enhance system performance and reliability.

The series is intended for networking systems, routers, security appliances, enterprise and cloud warm/cold storage, and industrial edge applications, ensuring the efficient handling of dynamic workloads.

The EPYC Embedded 8004 Series processors employ AMD’s Zen 4c cores to achieve increased levels of core density and performance-per-watt. The EPYC Embedded 8004 is the first processor series in the AMD embedded portfolio to integrate these cores, delivering improved platform efficiency and innovation. This enables hardware providers to design differentiated, energy-efficient platforms that deliver up to a 30% increase in performance-per-watt vs. the previous generation (Zen 3).

Available in 1P configurations ranging from 12 to 64 cores (24 to 128 threads) and supporting up to 1.152TB DDR5 memory capacity (2 DIMMs/channel with 96GB DIMM size), with Thermal Design Power (TDP) profiles ranging from 70W to 225W, these processors are intended to meet diverse application needs.

These processors have been engineered to handle data-intensive workloads, thanks to their high-speed I/O connectivity (96 lanes PCIe Gen 5) and expansive memory bandwidth (6 channels of DDR5-4800). These features allow system designers to connect SSDs, networking cards, and more components to create more flexible and scalable system configurations.

They come in a compact, SP6 socket form factor that is 19% smaller than AMD EPYC Embedded 9004 Series processors, consuming less space while being energy efficient. And the devices are backed by long lifecycles support of seven years, helping system designers maintain platform longevity.

Key integrated features include:

Direct Memory Access (AMD EPYC 4th Gen DMA): Designed to improve system efficiency and performance by offloading data transfers from the CPU, allowing cores to focus on critical application tasks.

Non-Transparent Bridging (NTB): Enhances system reliability by enabling data exchange between two CPUs in active-active configurations via PCI Express (PCIe), enabling continued operation in case of a failure.

DRAM Flush to NVMe: Helps ensure critical data is preserved by flushing it from DRAM to nonvolatile memory in the event of a power loss.

Dual SPI Support: Enables the use of two SPI ROMs, one for the BIOS image and another for a secure bootloader, providing an added layer of security.

Device Identity Attestation: Helps protect against unauthorized CPU upgrades by allowing cryptographic authentication of the processors.

Yocto Framework Support: Empowers customers to create a lightweight, optimized Linux OS for embedded systems.