Electronics industry's smallest Serial Flash memories?

The SpiFlash Serial Flash memories' small form factors make the devices suitable for space saving critical designs such as smartphones, Bluetooth headsets, cameras, GPS and other handheld products. The devices feature package dimensions as small as 3.4mm, with a range of densities from 512Kb to 16Mb. According to Winbond, the SpiFlash memories are available in eight pin, ultra thin small outline no lead and wafer level ball grid array packages and occupy less than 20% of the space used by 30mm packages. The USON 6mm (2 x 3 x 0.55mm) SpiFlash memories come in densities of 512Kb, 1Mb, 2Mb, 4Mb and 8Mb in 2.5V or 3V versions. 1.8V versions are also available for 2Mb and 4Mb densities. Winbond claims that the 8Mb USON is the industry's highest density available in such a package. The WLBGA devices are available in 8Mb (3.4mm) and 16Mb (4.8mm) densities that operate at 1.8V. The devices are 0.47mm in height and, according to Winbond, use 11% percent and 16% the space, respectively, of a WSON or SOIC package, making them the smallest and thinnest packages on the market today. The WLBGA packages are also designed to provide design security by preventing access to the chips' signals once mounted to pcbs. "Our new USON and WLBGA devices round out Winbond's broad portfolio of SpiFlash memories in standard packages such as SOIC, WSON and FBGA," said Robin Jigour, vice president of Flash Memory marketing at Winbond. "Small form factors, low pin count and low power, over a broad range of Serial Flash densities, make these new devices well suited for mobile and handheld applications that are increasingly challenged for available board space."