The certifications mean that mutual customers using Siemens’ AFS tool can now leverage these GF processes.
AFS is a key part of Siemens’ Solido Simulation Suite software and provides circuit verification for nanometre analogue, radio frequency (RF), mixed-signal, memory, and custom digital circuits. This Siemens EDA solution provides a unified platform for the broader integrated circuit (IC) design industry to develop mixed-signal and variation-aware verification capabilities with SPICE accuracy, high performance, high capacity and ease of use.
“Siemens is pleased to collaborate with GlobalFoundries as we continue to deliver advanced technologies that help our shared customers deliver innovative and compelling ICs to market more quickly,” said Amit Gupta, general manager, Custom IC Verification, Siemens Digital Industries Software.
GF’s 12nm FinFET platform is built using FinFET technology and offers high-performance SoC integration with low-power memory and logic. The platform allows for the integration of digital and analogue circuitry on the same chip, enabling more efficient designs for applications such as wireless communications, sensor interfaces, and automotive electronics.
Siemens’s AFS platform is now certified for 12LP and 12LP+ processes. In addition, Siemens and GF have an active partnership with Si2’s Compact Model Coalition (CMC) in the development of Open Model Interface (OMI), the industry-standard platform for enabling aging modelling and reliability analyses.
GF's 12LP and 12LP+ processes are now enabled with OMI, the industry-standard platform for enabling aging modelling and reliability analyses.
Siemens’ AFS is now certified for 22FDX+, a derivative of GF’s 22FDX platform with half-node performance and power improvements. 22FDX and 22FDX+ are built using FD-SOI technology that delivers high performance, minimal leakage and improved power efficiency. These platforms also support seamless integration of digital and analogue circuitry on the same chip, enabling more efficient designs for applications such as wireless communications, sensor interfaces, and automotive electronics.
