As a result of this certification, customers using Siemens‘ AFS platform can now leverage the performance enhancement and power efficiency of UMC‘s proven 28HPCU+ process for their next-generation analogue/mixed-signal designs.
“We continue to have a strong collaboration with UMC to provide comprehensive support for UMC’s process technologies for our mutual customers,” said Ravi Subramanian, senior vice president and general manager of IC Verification Solutions, Siemens Digital Industries Software. “Our Analog FastSPICE simulation technology complements UMC’s 28HPCU+ processes by providing mutual customers with a highly accurate, high-performance verification solution.”
The Analog FastSPICE platform provides circuit verification for nanometre analogue, radio frequency (RF), mixed-signal, memory and custom digital circuits. It delivers a unified platform with mixed-signal and variation-aware verification capabilities that deliver improved levels of accuracy, performance, capacity and functionality.
“Verification using Siemens‘ AFS platform on UMC’s production-ready 28HPCU+ process technology reduces the time for proof of analogue, improves verification accuracy and accelerates the design process,” said David Chen, senior division director of Technology Development at UMC. “We look forward to continuing our collaboration with Siemens to provide more design and verification tools for a variety of high-growth markets and applications.”
UMC’s 28HPCU+ platform looks to balance cost considerations and chip performance and is suited for a range of applications requiring high-speed and low-power consumption, including integrated circuits (ICs) for Wi-Fi, digital TV and flash controllers applications.
Compared to the company’s 28nm technology, the high-performance, low-power 28HPCU+ platform can offer up to a 15 percent boost in performance.