IBM, Hitachi research beyond 32nm

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IBM and Hitachi have signed a two year joint semiconductor metrology research agreement designed to speed the pace of semiconductor innovation. The agreement marks the first time Hitachi and IBM have collaborated on semiconductor technology.

The two companies will focus on 32nm and beyond semiconductor research and will use new methods that include the latest technologies to analyse semiconductor devices and structures in order to improve the characterisation and measurement of transistor variation – as well as to develop a better understanding of device physics. “Hitachi’s cutting edge semiconductor characterisation capabilities and IBM’s cmos research capabilities can help the two companies accelerate the pace of semiconductor innovation for the 32nm generation and beyond,” said Bernie Meyerson, vp of strategic alliances and cto of IBM’s Systems & Technology Group. “By combining individual research strength and IP, we reduce the significant costs associated with research needed to advance the next generation of chip technology.” “Hitachi’s significant expertise in analytical instrumentation and semiconductor physics can promote industry leading research for next generation semiconductor technology,” said Eiji Takeda, general manager of Hitachi’s Research & Development Group. “Our two companies have a long history of successful business collaboration and we look forward to extending this to include semiconductor metrology research.”