The device is intended to deliver scalable performance for hyperscale data centre server, 5/6G infrastructure, DPU and edge-of-network markets.
This advanced CPU chiplet proof-of-concept using Arm Neoverse CSS technology is designed for single or multiple instantiations within a single package, along with IO and application-specific custom chiplets to optimise performance for a variety of end applications.
Leveraging CPU chiplets, and customised application-specific chiplets, multiple target applications can be supported. When new chiplets become available, a cost-effective package level upgrade path can also be supported.
“Socionext is a leading provider of custom SoCs for global hyperscale data centre, automotive and networking customers. Driven by commercial and time-to-market benefits, there is a growing customer demand for granular compute power. Leveraging silicon re-use to create multiple product platforms enables innovative system architectures. With leading silicon node enablement and our partnership with Arm, we are designing and delivering highly integrated large scale silicon solutions to global customers,” explained Hisato Yoshida, Corporate Executive Vice President and the Head of Global Development Group at Socionext. “This chiplet complements our customers’ current SoC designs and provides system architects new degrees of freedom to deliver many platform variants for a product family.”
“Arm Neoverse CSS is unlocking greater accessibility to custom silicon and driving innovation across the chiplet ecosystem,” said Mohamed Awad, senior vice president and general manager, Infrastructure Line of Business, Arm. “The advanced chiplet proof-of-concept from Socionext is demonstrating what is possible through Arm Total Design and will accelerate the path to custom, workload-optimised solutions for our broader ecosystem.”
“TSMC is pleased to support Socionext and Armʼs flexible chiplet design with our 2nm technology, as well as our comprehensive ecosystem to accelerate time-to-market of customer product innovations,” added Dr. Cliff Hou, Senior Vice President of Corporate Research/Research and Development at TSMC.
