Engineering publications brought to you by Mark Allen

Chiplets

YorChip and Digitho developing 2D chiplet packaging for mass markets

Cadence delivers Arm-based system chiplet

Leading tech companies commit to imec’s Automotive Chiplet Program

First silicon-proven 3nm 24 Gbps UCIe subsystem validated

Synopsys powers UCIe-based multi-die designs with IP operating at 40 Gbps

Faraday unveils platform for multi-source chiplet designs

Tenstorrent and Movellus to enable next-generation chiplet-based AI and HPC solutions

Blue Cheetah and LG demonstrate successful silicon bring-up of chiplet-based design

OPENEDGES unveils UCIe chiplet controller IP

ASMPT and IBM look to advance bonding methods for chiplet packages for AI

Intel demonstrates first fully integrated optical I/O chiplet

Alphawave Semi tapes out multi-protocol I/O connectivity chiplet