The UCIe interconnect, the de facto standard for die-to-die connectivity, is critical for high-bandwidth, low-latency die-to-die connectivity in multi-die packages, enabling more data to travel efficiently across heterogeneous and homogeneous dies, or chiplets, that are used in modern AI data centre systems.
Synopsys’ 40G UCIe IP supports both organic substrate and high-density, advanced packaging technologies to give designers greater flexibility to explore different packaging options. The complete Synopsys 40G UCIe IP solution, including PHY, controller, and verification IP, is a key component of the company’s multi-die solution for fast heterogeneous integration from early architecture exploration to manufacturing.
“Heterogeneous integration with high-bandwidth die-to-die connectivity gives us the opportunity to deliver new memory chiplets with the efficiency needed for data-intensive AI applications,” said Jongwoo Lee, vice president of the System LSI IP Development Team at Samsung Electronics.
“Launching the first complete 40G UCIe IP solution underscores Synopsys’ continued investment in advancing semiconductor innovation,” said Michael Posner, vice president of IP product management at Synopsys. “Our active contribution to the UCIe consortium has enabled us to deliver a robust UCIe solution that helps our customers successfully develop and optimise their multi-die designs for high-performance AI computing systems.”
The capabilities of the new Synopsys 40G UCIe IP solution include:
Simplified Solution Eases IP Integration: Single reference clock feature simplifies the clocking architecture and optimises power - the IP speeds-up die-to-die link initialization without the need to load the firmware.
Silicon Health Monitoring Enhances Multi-Die Package Reliability: To ensure reliability at the die, die-to-die, and multi-die package levels, Synopsys 40G UCIe IP offers test and silicon lifecycle management (SLM) features. The monitoring, test, and repair IP and integrated signal integrity monitors enable diagnosis and analysis of the multi-die package from in-design to in-field.
Successful Ecosystem Interoperability: For on-chip interconnect needs of the latest CPUs and GPUs, Synopsys 40G UCIe IP supports the most popular on-chip interconnect fabrics including AXI, CHI chip-to-chip, streaming, PCI Express, and CXL. The IP is compliant with the UCIe 1.1 and 2.0 standards, which Synopsys helps to develop and promote as an active member of the UCIe Consortium.
Pre-Verified Design Reference Flow: The combination of Synopsys UCIe IP and Synopsys 3DIC Compiler, a unified exploration-to-signoff platform, is used in Synopsys’ pre-verified design reference flow that includes all the required design collateral such as automated routing flow, interposer studies, and signal integrity analysis.
Broad IP Solutions for Multi-Die Designs: In addition to UCIe IP and high-speed SerDes, Synopsys offers HBM3 and 3DIO IP to enable high-capacity memory and 3D packaging.
