Toshiba, SanDisk, open 300mm wafer NAND fab
Toshiba and SanDisk have announced the opening of Fab 5, the third 300mm wafer NAND fabrication facility at Toshiba's Yokkaichi Operations in Mie Prefecture, Japan.
Toshiba began construction of the facility in July 2010 and started volume production on 24nm process technology in July 2011 in a bid to meet the booming demand for NAND flash memory in devices such as smartphones and tablet pcs.
The Japanese electronics giant says Fab 5's first wafer outs will be available in August. The collaborators are now planning to transition to a 19nm manufacturing process technology, which is the world's smallest and most advanced process node.
