According to Siemens, and in collaboration with TSMC, it has delivered a certified Xpedition Package Designer automated workflow driven by the Innovator3D IC that can provide customers with an expanded number of design options despite time and design complexity pressures.
According to AJ Incorvaia, senior vice president, Electronic Board Systems, Siemens Digital Industries Software, “The combination of Siemens’ Innovator3D IC driven semiconductor packaging solutions and TSMC’s leading-edge 3DFabric advanced packaging platforms such as InFO have enabled our mutual customers to achieve remarkable and industry-disrupting innovations.”
Siemens’ automated design workflows for TSMC’s InFO_oS and InFO_PoP technologies are driven by the heterogeneous integration cockpit capabilities of the Innovator3D IC solution and includes Xpedition Package Designer software, HyperLynx DRC, and Calibre nmDRC software technologies, which are all considered to be industry leaders in semiconductor package design.
“Siemens has been a longstanding partner of TSMC, consistently increasing its value to the TSMC Open Innovation Platform (OIP) ecosystem by offering high-quality solutions that support next-generation semiconductor designs using TSMC’s leading-edge advanced process and packaging technologies,” said Dan Kochpatcharin, Head of Ecosystem and Alliance Management Division at TSMC. “We look forward to further strengthening our collaboration with OIP ecosystem partners like Siemens, enabling our customers to bring innovative semiconductor designs to future AI, HPC, and mobile applications.”
