Engineering publications brought to you by Mark Allen

World’s first highly integrated multi-mode LTE chipset supporting 450 MHz spectrum

CGD signs agreement with ITRI to develop GaN-based power supplies

imec unveils die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm

Binder expands M12 portfolio

Infineon announces next generation CoolGaN transistor families

Malaysia looks for over $100bn in semiconductor industry investment

Epic Venture Partners invests $8.1m in Rain AI

xAI raises $6bn as it looks to take on OpenAI

Dolphin Design and Raspberry Pi offer advanced chip power management

Nomadic control

HCLTech and Arm collaborate on custom silicon chips for AI workloads

Infineon looks to redefine power density and efficiency in AI server power supplies