Engineering publications brought to you by Mark Allen

Chiplets

Rapidus and IBM extend chiplet packaging collaboration

Eliyan closes $60mn Series B funding round

Alphawave Semi demonstrates 3nm 24Gbps UCIe subsystem

Silicon Box to invest $3.5 billion in new chip plant in Italy

YorChip working with Digitho to enable more secure chiplets

Keysight introduces Chiplet PHY Designer

YorChip unveils first Chiplet for Edge AI applications

Socionext collaborates with Arm and TSMC on 2nm multi-core CPU chiplet development

Tenstorrent selects Samsung Foundry to manufacture latest AI chiplet

Faraday unveils 2.5D/3D advanced package service for chiplets

QuickLogic and YorChip to develop low cost UCIe FPGA chiplets

YorChip launches first dual-use PHY for chiplets