Engineering publications brought to you by Mark Allen

Electronics

Wearables demand hit by cost-of-living pressures

Renesas introduces automotive Integrated Software Development Environment

AMD launches Ryzen Embedded V3000 Series processors

Full colour micro-led based true AR glasses

Pulsiv launches new power electronics technology

GOWIN unveils new 22nm high-performance FPGA family - Arora V

Siemens automates 2.5D and 3D IC design-for-test for next generation ICs

Providing options

Synopsys unveils unified emulation and prototyping system

Achronix acquires FPGA IP from Accolade Technology

Key building block for 100G PON networks unveiled

Siemens and UMC develop 3D integrated circuit hybrid-bonding workflow