Engineering publications brought to you by Mark Allen

Semiconductors

Element Six and Orbray collaborate on diamond wafers

Alphawave Semi expands partnership with Samsung Foundry

Worldwide chip sales see first month-to-month growth of 2024

Renesas and Indian ITH sign research and collaboration MoU

Vanguard International and NXP to build and operate 300mm fab in Singapore

Apollo to acquire stake in Intel’s Fab 34 in Ireland

Rapidus and IBM extend chiplet packaging collaboration

TSMC considered moving fabs out of Taiwan

Codasip introduces latest RISC-V core for power-efficient applications

ASML and imec open joint HIgh NA EUV Lithography Lab

AMD to challenge Nvidia with launch of new AI chips

Andes Technology announces new SoC and development board