Engineering publications brought to you by Mark Allen

News

Communications

First 176-layer NAND SATA SSD for data centres

Automotive

Macronix octaflash UW Series provides Flash solutions for NXP processors

Electronics

Swave raises €7m as it looks to bring the Metaverse to life

Robotics & UAVs

High-resolution module for 3D depth sensing and vision systems

ASIC & SoC

First working silicon of a DSP with embedded FPGA

Automotive

EnSilica chassis control ASIC enters mass production

Embedded Software

IAR Systems enable Visual Studio Code extensions

Test & Measurement

Test solution validated for FiRa Consortium PHY conformance

Automotive

Toshiba makes highly accurate SPICE models available

Automotive

Hailo collaborates with Renesas to enable efficient and safe automotive ECUs

EDA & Design Software

Ansys and TSMC collaboration delivers multiphysics design methodology for wireless chips

EDA & Design Software

Cadence achieves PCIe 5.0 specification compliance for PHY and Controller IP