Engineering publications brought to you by Mark Allen

Memory

sureCore announces low power memory compiler for 16nm FinFET

Global distribution agreement signed between Farnell and Alliance Memory

Microchip expands Serial SRAM portfolio with larger densities and increased speeds

Winbond extends secure flash family with new memory densities andPQC support

Silicon Motion unveils latest generation FerriSSD BGA SSD

Toshiba releases MCUs with expanded code Flash memory capacity

SK hynix begins volume production of industry's first HBM3E

sureCore announces ultra-low power memory IP for AI applications

Micron announces breakthrough in UFS packaging

Samsung launches 36GB HBM3E 12H DRAM, boosting capacity by 50%

Weebit Nano demonstrates ReRAM high reliability and performance

Renesas develops embedded MRAM macro for high performance MCUs