Engineering publications brought to you by Mark Allen

Worldwide semiconductor revenue fell 11% in 2023

YorChip unveils first Chiplet for Edge AI applications

Microchip launches 10 multi-channel remote temperature sensors

Renesas debuts dual-core Bluetooth low energy SoC with integrated Flash

Enhancing connectivity in control panels

Tomorrow’s Engineers Code now has 300 organisations working to deliver a more diverse workforce

StoreDot unveils I-BEAM XFCTM cell-to-pack concept

SkyWater Technology to produce POLYN’s first commercial voice processing chip

ROHM develops speech synthesis ICs for AVAS in electric vehicles

Perforce launches SaaS offering of Helix Core Version Control

Infineon launches ZVS flyback converter chipset

CUI Devices adds AC fans product line to thermal management portfolio