Engineering publications brought to you by Mark Allen

Semiconductors

Qorvo introduces next-generation Matter solution

Going green

TeraSignal introduces TSLink architecture

Imagination announces automotive GPU IP with FuSa advancement

AlixLabs qualifies APS for use in 300mm designs

Faraday unveils platform for multi-source chiplet designs

Ramon.Space UK to develop advanced onboard communication processors

Sondrel announces Advanced Modelling Process for AI chip designs

TASKING enhances tools support for NXP automotive microcontrollers and processors

Tenstorrent and Movellus to enable next-generation chiplet-based AI and HPC solutions

GlobalFoundries becomes Silicon Catalyst Partner

Advanced substrate market set for solid growth