The 3DFabric Alliance was formed to encourage 3D integrated circuit (IC) innovation, readiness and customer adoption when using TSMC’s 3DFabric, a family of 3D silicon stacking and advanced packaging technologies.
Advanced packaging has become a critical enabler to achieving the power, performance, area, and functionality, while optimising cost, in leading-edge applications, such as HPC/AI, automotive and cloud computing.
According to proteanTecs, by joining the TSMC 3DFabric Alliance - the first such collaborative effort in the semiconductor industry – it will have early access to TSMC technology to better serve mutual customers and streamline their complex 3D IC design processes.
Multiple customers have successfully implemented proteanTecs’ on-chip monitoring technology into their chips, manufactured using TSMC’s N7, N5 and N3 processes with the TSMC 3DFabric technologies including CoWoS and InFO advanced packaging platforms.
“We’re pleased to have proteanTecs join our 3DFabric Alliance and will work closely with them to offer our mutual customers an easy and flexible way to unlock the power of 3D IC in their designs,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “Our 3DFabric Alliance will help customers reach an entirely new level of performance and power efficiency required for the next-generation AI, HPC, and mobile applications.”
“The 3DFabric Alliance demonstrates TSMC’s keen awareness of the direction in which the semiconductor industry is evolving,” said Nir Sever, Senior Director of Business Development at proteanTecs. “proteanTecs is pleased to collaborate within the 3DFabric Alliance to accelerate the adoption of 3D heterogenous systems. As the chiplet ecosystem grows, we will continue to support the industry with monitoring solutions that elevate reliability and quality standards and give companies the confidence to scale.”
